Compiling KB-Sized Machine Learning Models to Tiny IoT Devices
Recent advances in machine learning (ML) have produced KiloByte-size models that can directly run on constrained IoT devices. This approach avoids expensive communication between IoT devices and the cloud, thereby enabling energy-efficient real-time analytics. However, ML models are expressed typically in floating-point, and IoT hardware typically does not support floating-point. Therefore, running these models on IoT devices requires simulating IEEE-754 floating-point using software, which is very inefficient.
We present SeeDot, a domain-specific language to express ML inference algorithms and a compiler that compiles SeeDot programs to fixed-point code that can efficiently run on constrained IoT devices. We propose 1)~a novel compilation strategy that reduces the search space for some key parameters used in the fixed-point code, and 2)~new efficient implementations of expensive operations. SeeDot compiles state-of-the-art KB-sized models to various microcontrollers and low-end FPGAs. We show that SeeDot outperforms 1) software emulation of floating-point (Arduino), 2) high-bitwidth fixed-point (MATLAB), 3) post-training quantization (TensorFlow-Lite), and 4) floating- and fixed-point FPGA implementations generated using high-level synthesis tools.
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09:05 20mTalk | Scenic: A Language for Scenario Specification and Scene Generation PLDI Research Papers Daniel J. Fremont University of California at Berkeley, USA, Tommaso Dreossi University of California at Berkeley, Shromona Ghosh University of California at Berkeley, USA, Xiangyu Yue University of California at Berkeley, USA, Alberto L. Sangiovanni-Vincentelli University of California at Berkeley, USA, Sanjit Seshia UC Berkeley Media Attached | ||
09:25 20mTalk | Compiling KB-Sized Machine Learning Models to Tiny IoT Devices PLDI Research Papers Sridhar Gopinath Microsoft Research, India, Nikhil Ghanathe Microsoft Research, India, Vivek Seshadri Microsoft Research, India, Rahul Sharma Microsoft Research Link to publication DOI Media Attached |